COPPER FOIL in Chinese translation

• 铜箔

Examples of using Copper foil in English and their translations into Chinese

Global Lithium Copper Foil Leader.
全球锂电铜箔领导.

Mitsui Copper Foil( Suzhou) Co Ltd.
三井铜箔（苏州）有限公司.

Mitsui Copper Foil( Hong Kong) Co Ltd.
三井铜箔（香港）有限公司.

Huizhou United Copper Foil Electronic Material Co Ltd.
惠州联合铜箔电子材料有限公司铜箔.

Copper printed circuit requires a lot of copper foil and copper brazing material.
铜印刷电路需要大量的铜箔和铜基钎焊材料。

Conversely, copper foil is used to coat negative active material graphite;
反之，铜箔是用来涂布负极活性材料石墨;

Copper foil is an irreplaceable basic material in the modern electronics industry.
铜箔是现代电子工业中不可替代的基础材料。

Copper printed circuit requires a lot of copper foil and copper brazing material.
印刷电路铜印刷电路需要大量的铜箔和铜基钎焊材料。

Lithium copper foil will not continue to grow every month with high-speed expansion.
锂电铜箔不会持续每个月增长，也不会高速扩产。

In 2016, China's copper foil accounted for 27% of copper exports.
年，中国铜箔占铜出口的27%。

Depending on the application, we have to choose different forms of copper foil.
根据不同的应用，我们必须选择不同形式的铜箔。

The copper foil is made of copper and a certain proportion of other metals.
铜箔由铜和一定比例的其他金属制成。

Layer: equivalent to common PCB copper clad plate, thickness of copper foil loz to 10oz.
Layer线路层：相当于普通PCB的覆铜板，线路铜箔厚度loz至10oz。

There are holes in the copper foil, used to install electronic components, known as drilling.
在铜箔上钻一些孔来安装电子元件，称为钻孔。

In some low-cost applications, copper foil may only be pressed on one side of the substrate.
在一些低成本的场合，可能只会在基材的一面压制铜箔。

Layer circuit layer: equivalent to ordinary PCB copper clad, line copper foil thickness loz to 10oz.
Layer线路层：相当于普通PCB的覆铜板，线路铜箔厚度loz至10oz。

Japan monopolizes high-end copper foil market China's copper foil import dependence is declining.
五、日本垄断高端铜箔市场中国铜箔进口依赖度呈下滑态势.

Imported copper foil is expected to reach 140,000 tons in 2010, a 30% increase over 2009.
年进口铜箔预计将达到14万吨，比2009年增长了30%。

The first processing technique of general substrate+ transparent rubber+ copper foil is to make via holes.
一般基材+透明胶+铜箔的第一个加工工艺就是制作过孔。

The first processing technique of general substrate+ transparent rubber+ copper foil is to make via holes.
一般基材+透明胶+铜箔的第一道加工工序是制孔。