Examples of using Power modules in English and their translations into Korean
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Colloquial
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Ecclesiastic
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Ecclesiastic
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Programming
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Computer
A combination of these modules are used for small power stations and these may use from one to 20 units per power section and these sections can be combined to involve hundreds of power modules.
We're already powering thousands of applications around the globe and our new board-mounted power modules will continue to build Artesyn's reputation for products with outstanding performance,
Smaller and more efficient power modules have accelerated the evolution of distributed power architectures, enabling power systems with higher efficiency, power density, and other key performance attributes.
Power modules are mainly used in industrial
For example, SiC power modules can reduce power consumption in electric cars by 10% and the energy consumption in data centers by 5%, just as they can lower the weight of an airplane by 500 kilos.
SiC power modules can reduce power consumption in electric cars by 10 percent and the energy consumption in data centers by 5 percent, just as they can lower the weight of an airplane by more than 1,100 lbs.
For example, SiC power modules can reduce power consumption in electric vehicles by 10% and the energy consumption in data centers by 5%, just as they can lower the weight of an airplane by 500 kilos.
Similarly, it has opened the door to the US market, where demand for the power modules manufactured by Danfoss Silicon Power is expected to grow explosively," says Claus A. Petersen, General Manager and Senior Vice President of Danfoss Silicon Power. .
microwave electric vacuum devices, microwave semiconductor devices, microwave integrated circuits(solid state devices) and microwave power modules according to their working principle, materials and processes.
widely used in electronics field, such as package housings, carriers, substrates and lids etc, having a better compatibility and heat dissipation to prolong the working life of high power modules.
CAGR of 9 percent, power discretes will increase 11 percent, and power modules will rise 32 percent.
Thermal solutions for these power modules must be lightweight,
Tungsten copper heat sink materials are metal-based MMC electronic packaging materials, because it has good thermal conductivity and low thermal expansion coefficient and good microwave shielding, high strength, etc., and by adjusting the composition of the copper content of the different requirements available thermal expansion coefficient and thermal conductivity, and therefore tungsten copper sheet for electronic packaging materials have been favored by Western countries, a large number being used in the microwave tubes, power modules and integrated circuit chips.
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