Adhesion modifier for fiber compounds: SCONA TPPP 9212 GA Adhesion modifier to improve the mechanical properties of polypropylene filler and glass fiber compounds, polypropylene natural fiber compounds and one-packs in polypropylene.
For example, the surface tension of the coating is higher than that of the substrate, this manifests itself in poor wetting(high contact angle) and, with that poor adhesion and cratering.
Waterborne polyurethane resins, in particular, deliver outstanding adhesion, while cross-linking agents can be used to enhance strength, adhesion and resistance to water, heat and moisture.
Ag/AgCI(silver/silver chloride) is used in the electrode element to increase the adhesion of the electrodes with the skin by the adhesive gel, enabling more accurate, stable monitoring.
Waterproofing materials such different ecologicalcleanliness- they can cover the inside even potable water tanks. High adhesion and vapor-permeable polymer plaster makes a greatmaterial for interior decoration with high humidity.
Utilizing its adherence to various base materials and its high elasticity, urethane resins are widely used in applications that include fiber, leather, and metal adhesives.
high hardness Excellent adhesion Less smooth, droplets Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles.
Without the adhesion of London to the regime of freedom of movement, which would allow an exit, to some extent, mitigated by Europe, EU citizens would be equivalent to other foreign and probably subject to limits on the residence permit and the possibility of exercising work on English soil.
And in the printing process, due to the need to spray a layer of primer to increase adhesion or add background, so the product surface without contact with the printed film, you can avoid damage to the product surface and its integrity.
Industrial Application: Hydrophilizing Treatments for PolyimidesPolyimides are widely used as insulating material for electronic circuits and as protective film for the surface of semiconductor devices. The increasing integration and complexity of electronic circuits, however, have created a number of new issues, including problems of adhesion to metal used for wiring materials in circuits, and adhesiveness in the face of multi-layered circuits and devices.
密着性&帯電防止効果。
Adhesion& antistatic performance.
テープテスト(密着性試験)。
Tape Test(adhesion test).
高密着性(対UBM)。
High adhesion to UBM.
密着性、導電性が高い。
High adhesion and conductivity.
密着性向上プロセス「GliCAP」。
Chemical Adhesion Process“GliCAP”.
良い、安定した密着性。
Good and steady adhesion.
塗膜密着性の向上、バインダー不要。
Improvement of coating film adhesion, no binder required.
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