Examples of using Backplane in English and their translations into Chinese
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Backplane Connectors Board.
Backplane Ethernet Extension Protocol.
背板太网扩展协议.Impel Plus Backplane Cable Assemblies.
ImpelImpelPlus背板电缆组件.Backplane Ethernet Extension Protocol or Beep.
背板太网扩展协议简称Beep.Many communications systems are powered via a 48V backplane.
许多通信系统通过48V背板供电。The I/O modules acquire power from the backplane.
I/O模块从背板上获取电源供电。Also important for the purchase is always the backplane capacity.
对购买也很重要的是背板的容量。Because of the glass backplane design, it looks more high-end.
由于采用玻璃背板的设计，因此在外观上显得比较高端一些。The device capacity includes the number and types of ports available and the backplane speed.
设备的性能包括可用的端口数量和类型以及背板速度。The utilization of the backplane bandwidth is closely related to the internal structure of the switch.
背板带宽资源的利用率与交换机的内部结构息息相关。Electrical noise is often transmitted via the central direct current(DC) power-supply backplane found in factory automation equipment.
电气噪声通常通过工厂自动化设备中的中央直流（DC）电源背板传输。A DSUB connector in the backplane enables communication to the in-site control station or RFHIC's dedicated graphical user interface.
在背板还配有一个DSUB接口，可以与现场控制站或RFHIC的专用图形用户界面进行通信。Therefore, when choosing a switch, it doesn't make much sense if the backplane bandwidth number is large.
因此，在选择交换机的时候，如果仅仅是背板带宽数字大，并没有多少意义。Because backplane transmissions of 10Gbps can be achieved on multiple channels, effective transmission speeds in excess of 10Gbps are enabled.
由于中间背板10Gbps传输通过多通道实现，因此可获得高于10Gbps的有效传输速度。Area demand for OLED TV panels using the oxide backplane technology also increased by 106 percent during the same period.
此外，2017年氧化物背板技术用于OLEDTV面板的面积需求量也同比增加了106％。Construction: the wall placed by the showcase backplane for the opaque plate, optional and cabinet appearance the same color, white or mirror.
Plessey Semiconductors and Jasper Display Corp(JDC) announced a partnership in the development of a monolithic microLED using GaN-on-Silicon wafers and JDC's eSP70 silicon backplane.
PlesseySemiconductors和JasperDisplayCorp（JDC）宣布合作开发使用GaN-on-Silicon晶圆和JDC的eSP70硅背板的单片microLED。The expansion interfaces include the PC104 family, the PCI-E family, the PCI family, etc. In conjunction with industrial motherboards, the backplane supports multiple extensions.
扩展接口有PC104家族,PCI-E家族,PCI家族等,配合工业母板,底板使用支持多个扩展。Local communication with the other modules 1114 through the backplane 1116 is accomplished by means of a backplane interface 1132 which electrically connects the backplane 1116 through connector 1130.
通过背板1116与其他模块1114的本地通信是借助底板接口1132来完成，该底板接口通过连接器1130电连接到底板1116上。TFT backplane technology is crucial in the fabrication of AMOLED displays.
TFT背板技术是制造AMOLED显示屏的关键。
