Gallium Nitride: N type, p type and semi-insulating gallium nitride substrate and template or GaN epi wafer for HEMT with low Marco Defect Density and Dislocation Density for LED, LD or other application.
When several kinds of aluminum nitride filler are blended and filled at 80 vol%, the thermal conductivity becomes 12 W/ mK and it shows about 60 times the thermal conductivity of epoxy resin alone.
Feature1The nitriding processing using ionized nitrogen gas does not involve any chemical reactions and provides a clean working environment without the need for special anti-pollution equipments.
This treatment offers great nitriding power and great low-temperature viscosity. It is the ideal treatment(from a technical and economic point of view) for replacing hard chromium-plating on engine valves.
Chromium| Plansee The hard material coatings chromium(Cr) and chromium nitride(CrN) optimally protect engine components such as piston rings against premature wear and consequently extend the useful life of important engine parts.
It extends the nitridation capabilities of the DPN product portfolio for the dynamic random access memory(DRAM) peripheral gate and complements Applied's long-standing, leading-edge nitridation technology for logic devices.
Hard chromium, nitriding, and HCOF treatments are all available for the ball surface treatment, improving hardness, abrasion resistance, fatigue resistance, corrosion resistance and performance under high temperature.
With a band gap of 3.4 eV, gallium nitride emits invisible ultraviolet light, but when some of the gallium is exchanged for indium, colors like violet, blue, and green are produced.
We also introduced the first in Japan, ultra-large nitriding furnace(PPD furnace), making it possible to apply nitriding to improve the durability of large dies, such as casting dies for automobile exterior panels.
Characteristics Hexagonal boron nitride powder is a material showing excellent thermal conductivity, heat and corrosion resistance, electric insulation, lubrication/demolding performance, and used as an additive to various types of matrixes.
Applied's ALD systems deposit a variety of oxides, metal nitrides, and metals on the wafer one fraction of a monolayer at a time to create ultra-thin layers in advanced transistor, memory, and interconnect applications.
In my research, polar semiconductor oxides and nitrides with very large spontaneous polarization are also considered as a candidate. I promote the research and development for these materials by exploiting the function of polarization interfaces.
In 1971, we began sales of fused silica and boron nitride based on application of the sintering technology we accumulated through our manufacture of carbide and calcium cyanamide(nitrogenous lime). We also developed various fine ceramics materials thereafter.
We are able to control the composition of the nitriding layer, including the thickness of the compound layer, by controlling the atmosphere. This enables us to provide optimal nitriding properties to accommodate the required function.
Compared with existing inorganic compounds such as oxides and nitrides, unique coordination and crystal structures are obtained from such mixed anion compounds, it is possible that fundamentally different, innovative functions may be created.
Material When resistance to chemicals, such as alkalis and acids, and resistance to corrosion are required, alumina UHA-99 is used. When resistance to heat is required, silicon nitride EC-141 is used.
In addition to traditional sapphire, silicon(Si), and silicon carbide(SiC) substrate materials, zinc oxide(ZnO) and gallium nitride(GaN) are also the focus of current LED chip research.
日本語
中文
عربى
Български
বাংলা
Český
Dansk
Deutsch
Ελληνικά
Español
Suomi
Français
עִברִית
हिंदी
Hrvatski
Magyar
Bahasa indonesia
Italiano
Қазақ
한국어
മലയാളം
मराठी
Bahasa malay
Nederlands
Norsk
Polski
Português
Română
Русский
Slovenský
Slovenski
Српски
Svenska
தமிழ்
తెలుగు
ไทย
Tagalog
Turkce
Українська
اردو
Tiếng việt