英語 での Epoxy resins の使用例とその 日本語 への翻訳
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Specialty epoxy resins Various glycidyl ethers, glycidyl esters, brominated epoxy flame retardants(SR-T series), reactive cationic agents(SY-GTA80) and more.
In particular, we have accumulated many years of experience working on fillers for semiconductor sealing epoxy resins, and low uranium(low alpha) grades are also available for memory applications.
EPICLON epoxy resins are widely used in the fields of coatings, electrical/electronics, civil engineering, construction, and adhesives.
Rheology additive for plastic applications: BYK-R 606 Solvent-free rheology additive for plastic applications such as vinylester and epoxy resins, unsaturated polyester resins, and gel coats to reinforce the rheological effectiveness of fumed silica.
Carbon fibers feature very high tensile strength, and by combining them with epoxy resins, etc., it is possible to make composite materials that feature very light in weight and high kinetic properties including strength.
Rheology additive for plastic applications: BYK-R 605 Liquid rheology additive for plastic applications such as vinylester and epoxy resins, unsaturated polyester resins, and gel coats to reinforce the rheological effectiveness of fumed silica.
as well as acrylic, PU and epoxy resins to reduce viscosity and prevent settling.
Features LUXYDIR(former trade name: UNIDIC) amide-imide resins have rigid imide backbone and terminal carboxyl groups which is useful for application as hardener for epoxy resins.
as well as acrylic, PU and epoxy resins to reduce viscosity and prevent settling.
Epoxy resins also have a wide range of viscosities, from solventless types to solvent solution types, which makes them optimal as ink ingredients where viscosity characteristics are important.
When using epoxy resins for impregnation and lamination, heat resistance, mechanical strength, modulus and flame retardancy are primarily demanded. When using them for FRP molding, fast curability is demanded.
High molecular weight type epoxy resins are primarily used in baking finishes. Since they have a high molecular weight, they excel in coat forming ability in a single fluid.
Wet and dry adhesion, tensile strength and water resistance in quartz-filled epoxy encapsulants, sand-filled epoxy concrete repair materials, and metal-filled epoxy resins for mold die tools.
SUMIKAEXCEL 5003P is essentially plastic in behavior, thus has both a high Tg and flexural modulus. Therefore, it has the ability to add plasticity to epoxy resins without degrading the overall performance of the composite itself.
The Electronics Business sells Nagase ChemteX liquid epoxy resins and other products to customers in the heavy electrical, light electrical, car electronics, environment and energy, semiconductor, and other industries through locations in Japan, North America, and China.
SACHEM's low-viscosity glycidylethers serve to dilute the higher viscosity epoxy resins based on bisphenol-A, bisphenol-F, and novolak, and other polymers like polyurethanes and acrylics.
The epoxy resins transparency is not high, which are normally used in LED, it could cause a acting as the filter, but This using the resin is processed color wavelength to be stable.
In our Functional Materials Business, we are involved with materials that have a broad range of functions, including epoxy resins that serve as an insulating material for semiconductor encapsulation, UV-curable resins, and polyimide/polyamide resins that are noted for their high durability.
As the company is still in its beginning stages in Korea, it looks forward to increasing production volume in the future and introducing other Asahi Kasei E-Materials products to Korea, including plastic optical fibers, display materials, photopolymers, printing-plate making systems, buffer coat materials and epoxy resins& latent hardeners.
Reduction in the flooding/floating of colored pigments in gel coats. BYK-W 966Wetting and dispersing additive for filled unsaturated polyester resins as well as acrylic, PU and epoxy resins to reduce viscosity and prevent settling.