Examples of using Circuits in English and their translations into Telugu
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Ecclesiastic
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Colloquial
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Computer
Some test holes are equipped at the circuits, which can facilitate the insertion of test pen and take the great convenience for safety examination and test.
package that is increasingly used in integrated circuits(ICs).
protective devices used for overload protection of electric motors, contactors or other electrical equipment and electrical circuits.
The lengths of the I/O lines of high-speed circuits, such as multiple I/O lines and differential amplifiers and balanced amplifiers, should be equal.
Motor‘s load short circuits protection when the motor short circuit occurs in running,
leased circuits, internet leased circuits, cable or dish antenna.
Short circuits between the power-supply output and ground can create currents within the system that are limited only by
tours to visit Buddhist circuits and much more.
LC resonant circuits, etc.) on the stator assembly.
so oscillator circuits incorporating them became known as crystal oscillators, but other piezoelectric materials including polycrystalline ceramics are used in similar circuits.
PMICs or PMU as unit) are integrated circuits(or a system block in a system-on-a-chip device) for managing power requirements of the host system.
A closed magnetic circuit configuration avoids crosstalk and is suitable for high-density PCBs.
Oxisensor is a high-accuracy SpO2 probe with integrated oxygen measurement circuit.
Socket outlet supply circuit(1 circuit per socket outlet).
from single sided to complex, multi-layer Printed Circuit Boards and top level assemblies(PCBA).
Even a novice can understand how to knit product, if the circuit is good quality and the next will be given a description.
A characteristic feature of this circuit is that at the end of the home straight,
Before the development of the PCB, circuit board materials were mostly covered by nests of entangled,
The equipment adopts the high-high voltage source type inverter circuit structure, the power units are connected in series,
flip chip connects die and package substrate by directly facing down IC in order to make it attached to substrate, circuit board or carrier.