Приклади вживання Wafer sheets Англійська мовою та їх переклад на Українською
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With the help of an inclined set knife, the filling from the smooth roll is transferred to the wafer sheets moving along the conveyor installed under the spreading head.
During a full turn of the chain conveyor(2- 3 min), wafer sheets are baked, the top plate is
Such wafers are obtained by applying a film of iris mass to the wafer sheets, then closing these layers on top with the following sheets
When making piece products from wafer sheets prepared without sugar,
due to the presence of which the sheets are well separated from the waffle irons and the wafer sheets are of satisfactory quality.
prepared from dough with sugar, can be rolled in a hot kind into tubes with the help of a stick(at temperature 35-75° the wafer sheets are plastic).
but on the contrary, in wafer sheets with a very small moisture gradient between individual areas of the sheet, an increase in humidity gradient occurs.
In the manufacture of figured waffles with fillings, wafer sheets are smeared with starch paste at the edges,
Baking wafer sheet consists of two simultaneous processes:
Or the form with a wafer sheet.
The wafer sheet in a strictly fixed position is fed under the first head of the spreading machine,
Add up the shrill shafts of wafer sheets and two shariv fillings.
iris results in a significant loss of crispy properties of wafer sheets.
The temperature of the wafer sheets in the stack decreases to ambient air temperature in approximately 12 hours.
Thus, the gluten of flour affects the consistency of the dough and the quality of the wafer sheets.
At the same time, the edges of the wafer sheets that are in direct contact with air cool down faster than the middle part of the sheets. .
The layer of wafer sheets in a mechanized way is carried out by a spreading machine consisting of one corrugated
The optimal baking conditions for wafer sheets intended for interlayer fillings should be considered the temperature of the heating surface of the oven 170° С with a baking duration of about 2 min.
between which there is a layer of glued wafer sheets.
The temperature of the wafer sheets immediately after baking decreases rapidly(from 149 to 76° C) due to a significant temperature difference between the sheet and the surrounding air,